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B660 AORUS ELITE AX DDR4 (rev. 1.0)
BUILD SMART. GO ELITE.
Ever wonder why your system underperforms? You may be surprised how a motherboard could critically bottleneck the system performance, especially when it falls short on both the power and thermal design. With a limited budget, it is even more important to spend it wisely. Introducing AORUS ELITE motherboards, featuring the best-in-class digital power design, the best-in-class full-metal heatsink, and the best-in-class DDR4 XMP compatibility. It only takes a small step-up to be the best-in-class. Build Smart. Go ELITE.
Intel® B660 AORUS Motherboard with 12*+1+1 Twin Hybrid Phases Digital VRM Design, Fully Covered Thermal Design, 3 x PCIe 4.0 M.2 with Thermal Guard, 2.5GbE LAN, WIFI 6E 802.11ax, RGB FUSION 2.0, Q-Flash Plus
- Supports 12th Gen Intel® Core™ Series Processors
- Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
- 12*+1+1 Twin Hybrid Digital VRM Design with 60A DrMOS
- Shielded Memory Routing for Better Memory Overclocking
- Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
- WIFI 6E 802.11ax 2T2R & BT5 with AORUS Antenna
- Blazing Fast 2.5GbE LAN with Bandwidth Management
- Dual Ultra-Fast NVMe PCIe 4.0* x4 M.2 with Thermal Guard
- Rear and Front USB3.2 Type-C® for Fast and Versatile Connections
- Pre-installed IO Shield for easy and quick installation
- RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
- Smart Fan 6 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
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We want you to be 100% satisfied with your purchase. Items can be returned or exchanged within 30 days of delivery.
| GroupName | Name | Value |
|---|---|---|
| Specifications | Audio | Realtek® Audio CODEC; High Definition Audio; 2/4/5.1/7.1-channel * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. Please visit GIGABYTE's website for details on configuring the audio software.; Support for S/PDIF Out |
| Specifications | Chipset | Intel® B660 Express Chipset |
| Specifications | Form Factor | ATX Form Factor; 30.5cm x 24.4cm |
| Specifications | I/O Connectors | 1 x USB Type-C® port, with USB 3.2 Gen 2 support; 1 x USB 3.2 Gen 2 Type-A port (red); 4 x USB 3.2 Gen 1 ports; 4 x USB 2.0/1.1 ports; 2 x SMA antenna connectors (2T2R); 1 x DisplayPort; 1 x HDMI 2.0 port; 1 x RJ-45 port; 1 x optical S/PDIF Out connector; 2 x audio jacks |
| Specifications | Integrated CPU Graphics | Integrated Graphics Processor-Intel® HD Graphics support: 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz * Support for HDMI 2.0 version and HDCP 2.3.; 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz * Support for DisplayPort 1.2 version and HDCP 2.3 |
| Specifications | LAN | Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) |
| Specifications | Memory/Type/Bus/Max. | Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHz memory modules; 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory; Dual channel memory architecture; Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode); Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules; Support for Extreme Memory Profile (XMP) memory modules |
| Specifications | PCI Slots | 1 x PCI Express x16 slot, running at x16 (PCIEX16); 2 x PCI Express x1 slots |
| Specifications | Processor Support | Support for 12th Generation Intel® Core, Pentium® Gold and Celeron® Processors |
| Specifications | Raid | Support for SATA RAID 0, RAID 1, RAID 5, and RAID 1 |
| Specifications | RAM Type/Bus/Max. | Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHz memory modules; 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory; Dual channel memory architecture; Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode); Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules; Support for Extreme Memory Profile (XMP) memory modules |
| Specifications | Socket | LGA1700 socket: Support for 12th Generation Intel® Core, Pentium® Gold and Celeron® Processors |
| Specifications | Storage Interface | CPU: 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2A_CPU); Chipset: 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_SB); 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 3.0 x4/x2 SSD support) (M2M_SB); 4 x SATA 6Gb/s connectors |
| Specifications | Warranty | 3 Years |
| Specifications | Weight | |
| Specifications | Wireless Communication module | Intel® Wi-Fi 6E AX211: WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands; BLUETOOTH 5.2; Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate; |