M/B B660M A PRO AX DDR4 1.0
M/B B660M A PRO AX DDR4 1.0
M/B B660M A PRO AX DDR4 1.0
M/B B660M A PRO AX DDR4 1.0
M/B B660M A PRO AX DDR4 1.0

M/B B660M A PRO AX DDR4 1.0

$324.00
Tax included.
M/B B660M A PRO AX DDR4 1.0

M/B B660M A PRO AX DDR4 1.0

$324.00

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Product description

B660M AORUS PRO AX DDR4


PERFORMANCE UNLEASHED

Rule supreme with the B660 AORUS gaming motherboards. The new king of gaming platform continues the legendary AORUS bloodline with the most robust power delivery and dominant thermal design, glorified with the complete memory overclocking technology to crown your PC with the best Alder Lake's performance in all its gaming glory.


Intel® B660 AORUS Motherboard with 12*+1+1 Twin Hybrid Phases Digital VRM Design, Fully Covered Thermal Design, 2 x PCIe 4.0 M.2 with Thermal Guard, Intel® 2.5GbE LAN, WIFI 6 802.11ax, Rear USB 3.2 Gen 2x2 Type-C®, RGB FUSION 2.0, Q-Flash Plus


  • Supports 12th Gen Intel® Core™ Series Processors
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
  • 12*+1+1 Twin Hybrid Digital VRM Design with 60A DrMOS
  • Shielded Memory Routing for Better Memory Overclocking
  • Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
  • WIFI 6 802.11ax 2T2R & BT5 with AORUS Antenna
  • Blazing Fast Intel® 2.5GbE LAN with Bandwidth Management
  • Dual Ultra-Fast NVMe PCIe 4.0* x4 M.2 with Thermal Guard
  • SuperSpeed USB 3.2 Gen 2x2 Type-C® delivers up to 20Gb/s transfer speeds
  • Pre-installed IO Shield for easy and quick installation
  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
  • Smart Fan 6 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
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Tech Specs

GroupName Name Value
SpecificationsAudioRealtek® Audio CODEC High Definition Audio 2/4/5.1/7.1-channel * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. Please visit GIGABYTE's website for details on configuring the audio software. Support for S/PDIF Out
SpecificationsChipsetIntel® B660 Express Chipset
SpecificationsForm FactorMicro ATX Form Factor; 24.4cm x 24.4cm
SpecificationsI/O Connectors1 x USB Type-C® port, with USB 3.2 Gen 2x2 support 1 x USB 3.2 Gen 2 Type-A port (red) 4 x USB 3.2 Gen 1 ports 4 x USB 2.0/1.1 ports 2 x SMA antenna connectors (2T2R) 1 x HDMI port 1 x DisplayPort 1 x RJ-45 port 1 x optical S/PDIF Out connector 2 x audio jacks
SpecificationsIntegrated CPU GraphicsIntegrated Graphics Processor-Intel® HD Graphics support: 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz * Support for HDMI 2.1 version and HDCP 2.3. ** Support native HDMI 2.1 TMDS compatible ports 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz * Support for DisplayPort 1.2 version and HDCP 2.3 (Graphics specifications may vary depending on CPU support.)
SpecificationsLANIntel®2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
SpecificationsMemory/Type/Bus/Max.Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHz memory modules 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer "Memory Support List" for more information.)
SpecificationsMulti-Graphics TechnologySupport for AMD Quad-GPU CrossFire and 2-Way AMD CrossFire technologies
SpecificationsPCI Slots1 x PCI Express x16 slot, running at x16 (PCIEX16) * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot. (The PCIEX16 slot conforms to PCI Express 4.0 standard.) 1 x PCI Express x16 slot, running at x4 (PCIEX4) (The PCIEX4 slot conforms to PCI Express 3.0 standard.)
SpecificationsProcessor SupportLGA1700 socket: Support for 12th Generation Intel® Core, Pentium® Gold and Celeron® Processors* L3 cache varies with CPU * Please refer to "CPU Support List" for more information.
SpecificationsRaidSupport for SATA RAID 0, RAID 1, RAID 5, and RAID 10
SpecificationsRAM Type/Bus/Max.Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHz memory modules 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer "Memory Support List" for more information.)
SpecificationsSocketLGA1700
SpecificationsStorage InterfaceCPU: 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) Chipset: 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_SB) 4 x SATA 6Gb/s connectors Support for SATA RAID 0, RAID 1, RAID 5, and RAID 10 Intel® Optane Memory Ready * System acceleration with Intel® Optane Memory can only be enabled on the M.2 connector supported by the Chipset.
SpecificationsWarranty3 Years
SpecificationsWeight
SpecificationsWireless Communication ModuleWIFI Module WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band BLUETOOTH 5.2 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate * Actual data rate may vary depending on environment and equipment.